December 2013
FCPF7N60NT
N-Channel MOSFET
600 V, 6.8 A, 0.52 Ω
Features
? Typ R DS(on) = 460m Ω
? Ultra Low Gate Charge (typ. Q g = 17.8 nC)
? Low Effective Output Capacitance (typ. C oss(eff.) = 91 pF)
? 100% Avalanche Tested
? RoHS Compliant
Application
Description
The SupreMOS ? MOSFET is Fairchild Semiconductor’s next
generation of high voltage super-junction (SJ) technology em-
ploying a deep trench filling process that differentiates it from the
conventional SJ MOSFETs. This advanced technology and pre-
cise process control provides lowest Rsp on-resistance, superior
switching performance and ruggedness. SupreMOS MOSFET is
suitable for high frequency switching power converter applica-
tions such as PFC, server/telecom power, FPD TV power, ATX
power, and industrial power applications.
? Solar Inverter
? AC-DC Power Supply
D
D
G
S
TO-220F
G
MOSFET Maximum Ratings T C = 25 C unless otherwise noted.
S
o
Symbol
V DSS
Drain to Source Voltage
Parameter
FCPF7N60NT
600
Units
V
V GSS
I D
Gate to Source Voltage
Drain Current
-Continuous (T C = 25 o C)
-Continuous (T C = 100 o C)
±30
6.8*
4.3*
V
A
I DM
E AS
I AR
E AR
Drain Current
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
- Pulsed
(Note 1)
(Note 2)
20.4
79.4
6.8
0.6
A
mJ
A
mJ
dv/dt
P D
MOSFET dv/dt Ruggedness
Peak Diode Recovery dv/dt
Power Dissipation
(T C = 25 o C)
- Derate above 25 o C
(Note 3)
100
4.9
30.5
0.24
V/ns
V/ns
W
W/ o C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
-55 to +150
300
o C
o C
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
R θ JC
R θ JA
Parameter
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
FCPF7N60NT
4.1
62.5
Units
o C/W
?2012 Fairchild Semiconductor Corporation
FCPF7N60NT Rev. C2
1
www.fairchildsemi.com
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